Matou te iloa uma o le sputtering o se tasi lea o tekinolosi autu mo le sauniaina o mea ata tifaga.E faʻaaogaina ai ion na gaosia e le puna o le ion e faʻavave ai le faʻapipiʻiina i totonu o le vacuum e fausia ai se laʻau ion maualuga, osofaʻia le luga o le malo, ma faʻafeiloaʻi e le ion le malosi o le kinetic ma atoms i luga o le malo, ina ia mafai ai e atoms i luga o le malo. luga tu'u le malo ma tu'u i luga ole mea'ai.O le pomu malosi o le mea mataʻutia mo le teuina o ata e ala i le sputtering, lea e taʻua o le sputtering target.
O ituaiga eseese o mea ata tifaga sputtered ua faʻaaogaina lautele i semiconductor integrated circuits, puʻeina ala o faasalalauga, faʻaaliga planar, meafaigaluega ma le paʻu luga o le mate ma isi.
Sputtering sini e masani lava ona faʻaaogaina i faʻalapotopotoga faʻaeletoroni ma faʻamatalaga, e pei o fesoʻotaʻiga tuʻufaʻatasia, teuina o faʻamatalaga, faʻaaliga tioata vai, manatuaga laser, masini faʻaeletoroni, ma isi;E mafai foʻi ona faʻaaogaina i le fanua o le faʻapipiʻi tioata;E mafai foʻi ona faʻaaogaina i mea faʻaofuofu e faʻafefeteina, maualuga le vevela o le corrosion resistance, oloa teuteu maualuga ma isi pisinisi.
E tele ituaiga o sputtering sini, ma e iai auala eseese mo le faʻavasegaina o sini:
E tusa ai ma le tuufaatasiga, e mafai ona vaevaeina i le uʻamea, faʻamau faʻapipiʻi ma le faʻapipiʻiina o le sima.
E tusa ai ma foliga, e mafai ona vaevaeina i le sini umi, sikuea sikuea ma le taamilosaga lapotopoto.
E mafai ona vaevaeina i le microelectronic target, faʻamaumau faʻamaufaʻailoga, faʻapipiʻi tisiki mata, taulaʻi uʻamea taua, faʻasagaga tetee ata tifaga, sini faʻataʻitaʻiga faʻataʻitaʻiga, faʻasologa o le faʻaogaina o luga, faʻailoga matapulepule, faʻapipiʻi teuteuga, faʻaogaina o le eletise ma isi sini e tusa ai ma le fanua talosaga.
E tusa ai ma talosaga eseese, e mafai ona vaevaeina i semiconductor fesootai sima sini, pueina medium sima sini, faʻaalia sima sini, superconducting sima sini ma tele magnetoresistance sima sini.
Taimi meli: Iul-29-2022